Pure and Applied Chemistry

Pure Appl. Chem., 2005, Vol. 77, No. 2, pp. 391-398

http://dx.doi.org/10.1351/pac200577020391

Control of deposition profile of Cu for large-scale integration (LSI) interconnects by plasma chemical vapor deposition

Individual author index pages

• Kosuke Takenaka
• Masaharu Shiratani
• Manabu Takeshita
• Makoto Kita
• Kazunori Koga
• Yukio Watanabe

Other PAC articles by these authors

No other articles by these authors.