Pure and Applied Chemistry, 2007, Volume 79, No. 10, pp. 1755-1769, Other PAC articles by these authors

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Pure Appl. Chem., 2007, Vol. 79, No. 10, pp. 1755-1769

http://dx.doi.org/10.1351/pac200779101755

Factors affecting wettability and bond strength of solder joint couples

Natalia Sobczak¹, Artur Kudyba¹, Rafal Nowak¹, Waldemar Radziwill¹ and Krystyna Pietrzak²

¹ Foundry Research Institute, 73 Zakopianska Street, 30-418 Cracow, Poland
² Motor Transport Institute, 88 Jagiellonska Street, 03-391 Warsaw, Poland

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