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Pure Appl. Chem., 2007, Vol. 79, No. 10, pp. 1755-1769

http://dx.doi.org/10.1351/pac200779101755

Factors affecting wettability and bond strength of solder joint couples

Natalia Sobczak1, Artur Kudyba1, Rafal Nowak1, Waldemar Radziwill1 and Krystyna Pietrzak2

1 Foundry Research Institute, 73 Zakopianska Street, 30-418 Cracow, Poland
2 Motor Transport Institute, 88 Jagiellonska Street, 03-391 Warsaw, Poland

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