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Pure Appl. Chem., 2007, Vol. 79, No. 10, pp. 1755-1769

Factors affecting wettability and bond strength of solder joint couples

Natalia Sobczak1, Artur Kudyba1, Rafal Nowak1, Waldemar Radziwill1 and Krystyna Pietrzak2

1 Foundry Research Institute, 73 Zakopianska Street, 30-418 Cracow, Poland
2 Motor Transport Institute, 88 Jagiellonska Street, 03-391 Warsaw, Poland

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  • Vivet L., Joudrier A.-L., Bouttemy M., Vigneron J., Tan K.L., Morelle J.M., Etcheberry A., Chalumeau L.: Wettability and XPS analyses of nickel–phosphorus surfaces after plasma treatment: An efficient approach for surface qualification in mechatronic processes. Applied Surface Science 2013, 274, 71. <>
  • Vivet L., Joudrier A.-L., Tan K.-L., Morelle J.-M., Etcheberry A., Chalumeau L.: Influence of nickel–phosphorus surface roughness on wettability and pores formation in solder joints for high power electronic applications. Applied Surface Science 2013, 287, 13. <>
  • Hodaj Fiqiri, Petit Luc, Baggetto Loïc, Boisier Olivier, Verneyre Lionel: Undercooling of Sn–Ag–Cu alloys: solder balls and solder joints solidification. IJMR 2013, 104, 874. <>
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  • Klasik A., Sobczak N., Pietrzak K., Makowska K., Wojciechowski A., Kudyba A., Sienicki E.: Relationship Between Mechanical Properties of Lead-Free Solders and Their Heat Treatment Parameters. J Mat Eng Perf 2012, 21, 620. <>
  • Fima Przemysław: Surface tension and density of liquid Sn–Ag–Cu alloys. IJMR 2012, 103, 1455. <>
  • Dou Guangbin, Holmes Andrew S., Yeatman Eric M., Wright Robert V., Kirby Paul B., Yin Chunyan: Transfer of Functional Ceramic Thin Films Using a Thermal Release Process. Advanced Materials (Weinheim Germany) 2011, 23, 1252. <>
  • Sobczak N., Nowak R., Radziwill W., Budzioch J., Glenz A.: Experimental complex for investigations of high temperature capillarity phenomena. Mater Sei Eng A 2008, 495, 43. <>