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Pure Appl. Chem., 2002, Vol. 74, No. 3, pp. 381-395

http://dx.doi.org/10.1351/pac200274030381

Study for plasma etching of dielectric film in semiconductor device manufacturing. Review of ASET research project

Makoto Sekine

Plasma Technology Laboratory, Association of Super-advanced Electronics Technologies (ASET), 292 Yoshida, Yokohama 244-0817, Japan

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  • Seta Shoji, Shimizu Shinji: Mechanism of Microtrench Generation in Etching of Wiring Trench on SiO2 Layer: Proposal of Simulation Model using High-Pressure Etching Gas . Jpn J Appl Phys 2007, 46, 3589. <http://dx.doi.org/10.1143/JJAP.46.3589>
  • Amirov I. I., Alov N. V.: Polymer film deposition in inductively coupled radio-frequency discharge plasma of perfluorocyclobutane mixed with sulfur hexafluoride. High Energy Chem 2006, 40, 267. <http://dx.doi.org/10.1134/S0018143906040114>