Pure Appl. Chem., 1984, Vol. 56, No. 2, pp. 215-230
http://dx.doi.org/10.1351/pac198456020215
Basic phenomena in reactive low pressure plasmas used for deposition and etching-current status
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Pure Appl. Chem., 1984, Vol. 56, No. 2, pp. 215-230
http://dx.doi.org/10.1351/pac198456020215